Equipment parameters:
Description | Specifications |
Model | TR2023 |
Application | Semiconductor Test, Inspection and Packaging |
Package / Device Type | Discrete Leaded Packages: QFN, DFN, SOIC, SOT, SOD, Requirements of Down Force Control |
Down Force Control | Testing Station(Dynamic): 4-30N ± 15% |
Index Time | 60ms |
Performance Characteristic | UPH>50000 (QFN & DFN) MTBA>2H MTBF>168H Conversion Time≤2H Automatic Rejection and Replacement in Tape (Optional) Auto Reel Changer (Optional) |
User Interface | Windows 7-based Color Touchscreen Language: English and Chinese (Simplified), Other Upon Request |
Interface | Network: Ethernet Capability I/O Parallel Interface for Tester and Laser SECS GEM & SMV (Optional) GPIB (Optional) |
ESD | According to ANSI / ESD SP10.1 ESD Class 0 (Optional) |
Input | Bowl, Tube, Tape |
Output | Tape, Reel, Tube |
Processes | Device Orientation Device Flip Test Contacting up to 8 Stations Laser Marking 6 Sides Vision Inspection Bulk, Tube Sorting Aotu Reel Changer |
Inspection System | 1D/2DMC Code Reader 2D/3D Optical Lense (Optional) Mark, Surface, 5S In-Tape, Post Sealing Inspection |
Facility Requirements | Operating Voltage: AC 220V 50Hz Air Pressure Requirements: Positive Pressure≥0.5MPA Negative Pressure: 40~-80Kpa Power: 6kw |
Dimensions | Overall Dimension:1300*1000*1800mm Weight: 900kg |
Standards | CE, UL |
*The above parameters are subject to the actual product