Equipment parameters:
| Description | Specifications |
| Model | TS2020 |
| Application | Semiconductor Test, Inspection and Packaging |
| Package / Device Type | Applicable to SOP SOT SOD TO QFN 2X2 and above package series |
| Down Force Control | Testing Station(dynamic): 4 – 30N ± 15% |
| Index Time | 60ms |
| Performance Characteristic | UPH>50000 (QFN & DFN) MTBA>2H MTBF>168H Conversion Time ≤ 2H Automatic Rejection and Replacement in Tape (Optional) Auto Reel Changer (Optional) |
| User Interface | Windows 7-based Color Touchscreen Language: English and Chinese (Simplified), other upon Request |
| Interface | Network: Ethernet Capability I/O Parallel Interface for Tester and Laser SECS GEM & SMV (Optional) GPIB (Optional) |
| ESD | According to ANSI / ESD SP10.1 ESD Class 0 (Optional) |
| Input | Bowl, Tube, Tape |
| Output | Tape, Reel, Tube |
| Processes | Device Orientation Device Flip Test Contacting up to 8 stations Laser Marking 6 Sides Vision Inspection Bulk, Tube Sorting Auto Reel Changer |
| Inspection System | 1D/2DMC Code Reader 2D/3D Optical Lense (Optional) Mark, Surface, 5S In-Tape, Post Sealing Inspection |
| Facility Requirements | Operating Voltage: AC 220V Air Pressure Requirements≥0.5MPA Power:6kw |
| Dimensions | Overall Dimension: 1300*1000*1800mm Weight: 900kg |
| Standards | CE, UL |
*The above parameters are subject to the actual product