Equipment parameters:
Description | Specifications |
Model | TS205-HT |
Application | High Temperature Semiconductor Test, Inspection and Packaging |
Package / Device Type | Discrete Leaded Packages: QFN, DFN, SOIC, SOT, SOP,PDFN,SOD or Products have Requirements of Down Force Control |
Down Force Control | Testing Station(Dynamic): 4-30N ± 15% |
Temp Accuracy | 50°C~100°C±2°C 100°C~150°C±3°C |
Index Time | 60ms |
Performance Characteristic | UPH>5000 (Test Time 300ms) MTBA>2H MTBF>168H Conversion Time≤2H Automatic Rejection and Replacement in Tape (Optional) Auto Reel Changer (Optional) |
User Interface | Windows 7-based Color Touchscreen Language: English and Chinese (Simplified), Other Upon Request |
Interface | Network: Ethernet Capability I/O Parallel Interface for Tester and Laser SECS GEM & SMV (Optional) GPIB (Optional) |
ESD | According to ANSI / ESD SP10.1 ESD Class 0 (Optional) |
Input | Bowl, Tube, Tape |
Output | Tape, Reel, Tube |
Processes | Device Orientation Device Flip Test Contacting up to 8 Stations Laser Marking 6 Sides Vision Inspection Bulk, Tube Sorting Aotu Reel Changer |
Inspection System | 1D/2DMC Code Reader 2D/3D Optical Lense (Optional) Mark, Surface, 5S In-Tape, Post Sealing Inspection |
Facility Requirements | Operating Voltage: AC 220V 50Hz Air Pressure Requirements: Positive Pressure≥0.5MPA Negative Pressure: 40~-80Kpa Power: 7.5kw |
Dimensions | Overall Dimension: 1300*1300*1800mm Weight: 1200kg |
Standards | CE, UL |
*The above parameters are subject to the actual product