Equipment parameters:
| Description | Specifications |
| Model | PNP-1300 |
| Application | Tri-Temp Semiconductor Test, Inspection and Packaging |
| Package / Device Type | QFN,QFP,BGA,LGA,PLCC,PGA,CSP,TSOP, etc. |
| Temp Accuracy | -55℃~150℃±3℃ |
| Temp Range | Constant Temp to 150°C |
| Performance Characteristic | Max.UPH: 9300 (8sit, Ambient Temp) 7300 (8sit, Hot&Cold) MTBA≥2H MTBF≥168H Change Kit<30min Testing Pressure: Max240kg |
| Index Time | Min. 1.5s |
| ESD | Class 1(±35V, 3s) Class 0+Close Loop(±10V, 2s, Real-time Ionic Concentration Detection)(Optional) |
| Standards | CE, UL |
| Inspection System(Optional) | Optional 1:QR Code Detection Optional 2: OCR Detection |
| Input / Output | Jedec Tray |
| Communication Interface | TTL, GPIB, RS232, TCP/IP |
| Operating System | WIN7 |
| Facility Requirements | Operating Voltage:AC 380±10%V, 50Hz, Air Pressure Requirements: 0.4~0.7Mpa Power:18KW |
| Dimensions | Overall Dimension: 2140*1730*2270mm (Signal Excluded) Weight: 3200kg |
*The above parameters are subject to the actual product