Equipment parameters：
| Description | Specifications |
| Model | V1000 |
| Applications | Die bond / Wire Bond Auto Defect Inspection Machine |
| Performance Characteristic | UPH 180s/piece Pixel 1.2 μm MTBA>2H MTBF≥168H |
| ESD | According to ANSI / ESD SP10.1 ESD Class 0 (Optional) |
| Standards | CE, UL |
| Processes | Magazine Loading; Material Piece Pushing; Visual Positioning, AOI Inspection; MARK; NG Sorting, Good Products Unload |
| Inspection System | QR Code/Barcode Scanning Gun; 2D/3D AOI; Detection of Static Electricity Elimination |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA |
| Input / Output | Magazine Loading and Unloading (Substrate Strip or Metal Carrier) |
| Operating System / Interface | JRS supplied API for Windows 10-based color Language: English and Chinese (Simplified), other upon request |
| Facility Requirements | Operating Voltage：AC 220±10%V,50Hz, Air Pressure Requirements: 0.6~0.8Mpa Power：5.5KW |
| Dimensions | Overall Dimension: 1750*1150*1850mm |
*The above parameters are subject to the actual product
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