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3D AOI

Information

Equipment parameters:

Description Specifications
Model ARP-100 AOI 3D
Industry Applications SMT, PCBA, Semiconductor, Industrial
Inspection Functions Missing parts, Offset, Skewed, Polarity, Reverse Parts, Tombstone, Warping, Side Standing, Lifted/Bent Leads, Excess/Insufficient Solder, Poor Welding/Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), More/Less Tin, Climbing Tin, Pad Pollution, Foreign Material Detection, Polarity Dimple Measurement
Inspection Interface Function 29 Basic Detection Boxes
Index Time Modeling < 10 Min
Performance Characteristic First Pass Yield (FPY) of Single Board>99%
Overkill 30 DPPM
High Speed 0.4s/FOV
Operating System / Interface JRS supplied API for Windows 10-based Color Touchscreen
Language: English and Chinese (Simplified), other upon request
Lighting System 5 Different Light Source Choices:
White Light
Low Angle (Tin Type Light)
Color Light
True Color Drawings
3D Gray Medium
Resolution Ratio (um) 10.62 / 12.14 / 15.15 / 17.08
Image Range / FOV (m㎡) 43.5 x 32.6 / 49.7 x 37.3 / 62.1 x 46.6 / 70 x 52.5
Scanning Speed (cm²/sec) 28.36 / 37.1 /57.8 / 73.5
3D Technologies 4-way Projection, Fusion Depth Mapping
Single Field Speed 0.45s / FOV
Vertical Resolution < 1um
Vertical Alignment Accuracy < 3um (3 sigma)
Camera Vision Accuracy 10μm, 12μm, 15μm, 6μm
Standards CE/UL
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
Single Track Minimum (50x50mm) and Maximum (500x400mm);
Dual Track Minimum (50x50mm) and Maximum (300x400mm)
Board / Lot Tracebility Camera-Read Barcodes; External Barcode Reader Configured;
OCR Capability with Batch Code Logging
Facility Requirements Operating Voltage: AC 220V
Air Pressure Requirements: ≥ 0.5MPA
Power:2.5KW
Dimensions Overall Dimension: 1390*1080*1700mm
Weight 1200 KG

*The above parameters are subject to the actual product

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