Lead Scan-P5000

Equipment parameters：

Description	Specifications
Model	P5000
Application	Suitable for packaging inspection types: QFN, QFP, BGA, LGA, etc
Detectable Defect Surfaces	Frontside/Backside
Advantages	2D Inspection:10μm/pixel 3D Inspection: XY Resolution:12μm/pixel Z-direction Accuracy:±10μm FOV (field of view):49mmx37mm Inspection Speed(14×35 Tray):50K Overkill≤5000 PPM(0.5%) Missed≤50 PPM
Performance Characteristic	MTBA>2H MTBF>168H GR&R<10% Product Size Range：3mmX3mm~50mmx50mm Tray Dimension：322.6×135.9×7.62 mm
Inspection System	Dimensional Inspection Surface Defect Inspection Fiducial Mark Inspection Optical Character Verification (OCV/OCR) Solder Ball Coplanarity Inspection
Machine Auxiliaries	Number of lanes: 5 (1 feeding lane, 3 discharge lanes, 1 buffer lane) Vacuum pickup unit threshold monitoring (Automatic handling of pickup anomalies) Tray position monitoring in lanes (Abnormality detection) Loading/unloading method: Tray-to-Tray (Automatic sorting discharge for defective/non-defective units) Barcode scanner (Batch traceability) HMI: 24-inch touchscreen display (Graphical programming, user-friendly operation) Ionizing fan for static elimination
2D Coding and Strip Map	QR Code (Data Matrix) Reader Strip Map Capability

*The above parameters are subject to the actual product