DB&WB Defect Inspection-V2000

Equipment parameters：

Description	Specifications
Model	V2000
Applications	Die Bond / Wire Bond Multi Layer Wire Defect Inspection Machine
Maximum Number of Inspection Attributes (Number of Defects)	30+
Advantages	Inspection Resolution (μm/pixel)： 2D: 2.6μm/pixel 3D: XY Resolution: 3.6μm/pixel, Z-direction Accuracy: ±10μm Number of Cameras (Enumerate Each)：2D Camera1 and 3D camera1 FOV (field of view)：12mm*12mm Scanning Speed (per L/F)：16s % Over Rejection≤500PPM % Under Rejection≤100PPM
Performance Characteristic	MTBA≥2H MTBF≥168H GR&R＜10% UPH≥180 strips/h (LF size: 212mm x 63.42mm; Die size: 4.9mm x 4.44mm; No. of Unit per Strip: 5 rows and 22 columns) Minimum Package Size Capability (body size)：All Packages Maximum Leadframe Size Capability (L/F size)：100mm*300mm
Inspection System	Die Detection Solder Inspection Welding Wire Inspection Glue/Soldering Tin Inspection Frame/Pin Detection
Machine Auxiliaries	Leadframe Handler (Transfer Method) Leadframe Jam Detect Sensors Leadframe Rail Presence Sensor (Input and Output) Magazine Handler (IP/OP module) Barcode Scanner (lot processing) ESD Lonizers SECS/GEM
2D Coding and Strip Map	QR Code (Data Matrix) Reader Strip Map Capability
Operating System / Interface	Windows 10 Pro 19045.4894
Facility Requirements	Power Supply: AC220±10%V, 50Hz, 4.3kW Air Source: 0.5~0.6MPa, Inlet Pipe φ10mm, Air Consumption 200mL/min Temperature: 10°C – 35°C, Humidity 30% – 70%RH, (Non-Condensing)

*The above parameters are subject to the actual product